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ML12079
2.8 GHz Prescaler MECL PLL Components /64/128/256 Prescaler
Legacy Device: Motorola MC12079
The ML12079 is a single modulus divide by 64, 128, 256 prescaler for low power frequency division of a 2.8 GHz (typical) high frequency input signal. Divide ratio control inputs SW1 and SW2 select the required divide ratio of /64, /128, or /256. An external load resistor is required to terminate the output. A 1.2 k resistor is recommended to achieve a 1.6 Vpp output swing, when dividing a 1.1 GHz input signal by the minimum divide ratio of 64, assuming a 12 pF load. Output current can be minimized dependent on conditions such as output frequency, capacitive load being driven, and output voltage swing required. Typical values for load resistors are included in the Vout specification for various divide ratios at 2.8 GHz input frequency. * * * * 2.8 GHz Toggle Frequency Supply Voltage 4.5 to 5.5 V Low Supply Current 9mA Typical at VCC = 5.0 V Operating Temperature Range of TA = -40 to 85C
8 1
SO 8 = -5P PLASTIC PACKAGE CASE 751
8 1
FUNCTIONAL TABLE
SW1 H H L L
NOTE:
P DIP 8 = PP PLASTIC PACKAGE CASE 626 CROSS REFERENCE/ORDERING INFORMATION MOTOROLA PACKAGE LANSDALE P DIP 8 MC12079P ML12079PP SO 8 MC12079D ML12079-5P
SW2 H L H L
Divide Ratio 64 128 128 256
SW1 & SW2: H = VCC, L = Open.
Note: Lansdale lead free (Pb) product, as it becomes available, will be identified by a part number prefix change from ML to MLE.
MAXIMUM RATINGS
Characteristic Power Supply Voltage, Pin 2 Operating Temperature Range Storage Temperature Range Maximum Output Current, Pin 4 Symbol VCC TA Tstg IO Range -0.5 to 7.0 -40 to 85 -65 to 150 4.0 Unit Vdc C C mA IN VCC SW1 OUT
1 2 3 4 8 7 6 5
PIN CONNECTIONS
IN NC SW2 Gnd
(Top View)
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ML12079
LANSDALE Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = -40 to 85C, unless otherwise noted.)
Parameter Toggle Frequency (Sine Wave) Supply Current Output (Pin 2) Input Voltage Sensitivity Divide Ratio Control Input High (SW) Divide Ratio Control Input Low (SW) Output Voltage Swing (CL = 12 pF; RL = 1.2 k; IO = 2.7 mA)1 (CL = 12 pF; RL = 2.2 k; IO = 1.5 mA)2 (CL = 12 pF; RL = 3.9 k; IO = 0.85 mA)3 250-500 MHz 500-2800 MHz Symbol ft ICC Vin VIH VIL Vout Min 0.25 - 400 100 VCC Open 1.0 Typ 3.4 9.0 - - VCC Open 1.6 Max 2.8 11.5 1000 1000 VCC Open - Unit GHz mA mVpp V - Vpp
NOTES: 1. Divide ratio of /64 at 2.8 GHz. 2. Divide ratio of /128 at 2.8 GHz. 3. Divide ratio of /256 at 2.8 GHz.
Figure 1. Logic Diagram (ML12079)
D In In C
QB Q
D C
Q QB
D C
QB Q D C Q QB D C QB Q
D C SW2 SW1
QB Q
D C
QB Q
D C
QB Q Out
Figure 2. AC Test Circuit
VCC = 4.5 to 5.5 V C3 SINE WAVE GENERATOR C1 50 SW2 C2 IN GND OUT CL RL EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1 F CL = 12 pF (Including Scope and Jig Capacitance) RL = 1.2 k (for /64 at 2.8 GHz) VCC IN SW1
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Issue A
ML12079
LANSDALE Semiconductor, Inc.
Figure 3. Input Signal Amplitude versus Input Frequency
+15.0 +10.0 +5.0 0 -5.0 AMPLITUDE (dBm) -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 -45.0 -50.0 0 400 800 1200 1600 2000 2400 2800 3200 FREQUENCY (MHz) OPERATING WINDOW +1257.40 +707.11 +397.64 +223.61 +125.74 +70.71 mVrms mVpp +39.76 +22.36 +12.57 +7.07 +3.98 +2.24 +1.26 +0.71 3600
Divide Ratio = 64; VCC = 5.0 V; TA = 25C
Figure 4. Output Amplitude versus Input Frequency
2000 1600 1200 800 400 0 3600
0
400
800
1200
1600
2000
2400
2800
3200
FREQUENCY (MHz)
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Issue A
ML12079
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
8 5
-B-
1 4
P DIP 8 = PP PLASTIC PACKAGE (ML12079PP) CASE 626-05 ISSUE K
F
NOTE 2
NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC --- 10 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC --- 10 0.030 0.040
-A- L
C -T-
SEATING PLANE
J N D K
M
M TA B
H
G 0.13 (0.005)
M M
A
8
D
5
SO 8 = -5P PLASTIC PACKAGE (ML12079-5P) CASE 751-06 ISSUE T C
E
1 4
H
0.25
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0 7
h B C e A
SEATING PLANE
X 45
L 0.10 A1 B 0.25
M
CB
S
A
S
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. "Typical" parameters which may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by the customer's technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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Issue A

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